HCM
FX5U-32MT/ES
Delivery time:3 days
Control method | ||
I/O control method | ||
Number of input/output points | (1) Number of input/output points | |
(2) Remote I/O score | ||
Total score of (1) and (2) | ||
Programming Specifications | programming language | |
Programming Extensions | ||
Constant Scan | ||
Constant periodic interrupt | ||
Timer Performance Specifications | ||
Number of programs executed | ||
Number of FB files | ||
Operating Specifications | Execution Type | |
Interrupt Type | ||
Instruction processing time | LD X0 | |
MOV D0 D1 | ||
Memory Capacity | Program capacity | |
SD Memory Card | ||
Device/Label Memory | ||
Data Memory/Standard ROM | ||
Number of flash memory (flash ROM) writes | ||
Maximum number of stored files | Device/Label Memory | |
Data memory | P: Number of program files | |
FB: Number of FB files | ||
SD Memory Card | 2 GB | |
4G,8G,16GB | ||
Clock function | Display information | |
precision | ||
Power failure retention (clock data) | Retention method | |
Retention time | ||
Power failure retention (device) | Power failure holding capacity | |
Device Count | ||
User Device Points | Input relay (X) | Octal |
Output relay (Y) | Octal | |
Internal relay (M) | Octal | |
latching relay (L) | Octal | |
Link Relay (B) | Octal | |
Anunsheta (F) | Octal | |
Link Special Relay (SB) | Octal | |
Step Relay (S) | Octal | |
Timer system (timer (T)) | Octal | |
Integrating timer system (Integrating timer (ST)) | Octal | |
Counter system (counter (C)) | Octal | |
Counter system (long counter (LC)) | Octal | |
Data Register (D) | Octal | |
Link Register (W) | Octal | |
Link Special Register (SW) | Octal | |
System Device Scores | Special Relays (SM) | Octal |
Special Register (SD) | Octal | |
Unit Access Devices | Intelligent Function Unit Devices | Octal |
Index register score | Index register (Z) | Octal |
Long Index Register (LZ) | Octal | |
File register score | File Register | Octal |
Extended File Register (ER) | Octal | |
Nesting points | Nesting (N) | Octal |
Pointer points | Pointer (P) | Octal |
Interrupt pointer (I) | Octal | |
other | Decimal constant (K) | Signed |
Unsigned | ||
Hexadecimal constant (H) | ||
Real constant (E) | Single-precision | |
string | ||
Power Specifications | ||
Rated voltage | ||
Voltage fluctuation range | ||
Rated frequency | ||
Allowable instantaneous power outage time | ||
Power fuse | ||
Inrush current | ||
Power consumption | ||
DC24V Service Power Supply Capacity | ||
5VDC built-in power supply capacity | ||
Input Specifications | ||
Number of inputs | ||
Input connection shape | ||
Input Format | ||
Input signal voltage | ||
Input signal current | X000~X017 | |
Input impedance | X000~X017 | |
Input ON sensitivity current | X000~X017 | |
Input OFF sensitivity current | ||
Input response frequency | X000~X005 | |
X006~X017 | ||
Input response time (H/W filter delay) | X000~X005 | |
X006~X017 | ||
Input Response Time (Digital Filter Setting) | ||
Pulse waveform | ||
X000~X005 | ||
X006~X017 | ||
Input signal format (input sensor format) | ||
Input circuit isolation | ||
Input operation display | ||
Input circuit configuration | ||
Output Specifications | ||
Number of output points | ||
Output connection shape | ||
Output format | ||
External power supply | ||
Maximum load | ||
Open leakage current | ||
Voltage drop when ON | Y000~Y003 | |
Y004 or later | ||
Response Time | Y000~Y003 | |
Y004 or later | ||
Output circuit isolation | ||
Output operation display | ||
Output circuit configuration |
Stored program repetition operation
|
Refresh method
(direct access input/output is possible by specifying direct access input/output (DX, DY)) |
256 points or less / 384 points or less**
Supported with firmware version 1.100 or higher of the CPU unit. GX Works3 version 1.047Z or higher is required. |
384 points or less / 512 points or less**
Supported with firmware version 1.100 or higher of the CPU unit. GX Works3 version 1.047Z or higher is required. |
512 points or less
|
Ladder Diagram (LD), Structured Text (ST), Functional Block Diagram/Ladder Language (FBD/LD)
|
Function Block (FB), Structured Ladder, Label Programming (Local/Global)
|
0.2~2000ms (can be set in 0.1ms increments)
|
1~60000ms (can be set in 1ms increments)
|
100ms,10ms,1ms
|
32 bottles
|
16 bottles (up to 15 for users)
|
Wait Type, Initial Execution Type, Scan Run Type, Periodic Execution Type, Event Execution Type
|
Internal timer interrupt, input interrupt, high-speed comparison match interrupt, interrupt from unit**
Intelligent function unit, interrupt from high-speed pulse input/output unit. |
34ns*
* for 64k program capacitance steps. |
34ns*
* for 64k program capacitance steps. |
64k steps/128k steps* (128kByte/256kByte, flash memory)
*Supported with CPU unit firmware version 1.100 or higher. GX Works3 version 1.047Z or higher is required. |
Memory card capacity (SD/SDHC memory card: up to 16 GB)
|
120 KB
|
5 MB
|
Up to 2,<> times
|
1 bottles
|
32 bottles
|
16 bottles
|
This is the number of bottles that can be stored in the root folder of 511.
|
This is the number of bottles that can be stored in the root folder of 65534.
|
Year, month, day, hour, minute, second, day of the week (leap year automatic detection)
|
Monthly difference ±45sec/25°C (TYP)
|
The clock data is held using the power stored in the capacitance capacitor built into the large-capacity
capacitor sequencer. When the voltage of the large capacitor drops, the clock data is not retained correctly. The retention period by the capacitor is 30 days (ambient temperature: 10°C) when fully charged (energized sequencer for more than 25 minutes). The holding period by the capacitor varies depending on the operating ambient temperature. If the ambient temperature is high, the retention period will be shorter. |
10 days (ambient temperature: 25°C)
|
Up to 12K word
devices (high-speed) All devices in the area can be kept in power failure. If you use a battery, you can also hold the devices in the Devices (Standard) area. |
|
The total of X and Y assigned to 1024
input/output is up to 256 points/384 points*. *Supported with CPU unit firmware version 1.100 or higher. GX Works3 version 1.047Z or higher is required. |
The total of X and Y assigned to 1024
input/output is up to 256 points/384 points*. *Supported with CPU unit firmware version 1.100 or higher. GX Works3 version 1.047Z or higher is required. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
4096 points (fixed)
|
1024 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
1024 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
1024 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
1024 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
8000 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
10000 points (fixed)
|
12000 points (fixed)
|
65536 points (U□\G□)
|
The 24-point
index register (Z) and long index register (LZ) can be set for a total of 24 words or less. |
The 12-point
index register (Z) and long index register (LZ) can be set for a total of 24 words or less. |
32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters. |
32768 points (stored in SD memory card)
|
15 points (fixed)
|
4096 points
|
178 points (fixed)
|
16-bit: -32768~+32767
32-bit: -2147483648~+2147483647 |
16-bit time: 0~65535
32-bit time: 0~4294967295 |
16-bit: 0~FFFF
32-bit: 0~FFFFFFFF |
E-3.40282347+38~E-1.17549435-38,0,E1.17549435-38~E3.40282347+38
|
Shift JIS code Maximum half-width 255 characters (256 characters including NULL)
|
|
AC100~240V
|
-15%,+10%
|
50/60Hz
|
Operation continues for instantaneous power outages of 10 ms or less.
When the power supply voltage is AC200V, it can be changed to 10~100ms by user program. |
250V 3.15A Time Lag Fuse
|
Max. 25A 5ms or less / AC100V Max. 50A 5ms or less / AC200V
|
This value is the value when the DC30V service power supply is consumed at the maximum when the maximum configuration can be connected to a 24W
CPU unit. (including input circuit current) |
[When DC24V service power supply is used in the input circuit of the CPU unit]
Ambient temperature 0~55°C: 400mA Ambient temperature less than 0°C: 300mA [When external power supply is used for CPU unit input circuit] Ambient temperature 0~55°C: 480mA Ambient temperature less than 0°C: 380mA DC24V service power supply is consumed when I/O units are connected, and the available current is reduced. For details on DC24V service power supply, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware). |
900mA
|
|
16 points
|
Detachable terminal block (M3 screw)
|
Sink/Source
|
DC24V +20%,-15%
|
5.3mA/DC24V
|
4.3kΩ
|
3.5mA or more
|
1.5mA or less
|
For details on capturing pulses with a response frequency of
200kHz 50k~200kHz, refer to the MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware Edition). |
10kHz
|
ON: 2.5μs or less OFF: 2.5μs or
less |
ON: 30μs or less OFF: 50μs or less
|
None,10μs,50μs,0.1ms,0.2ms,0.4ms,0.6ms,1ms,5ms,10ms,20ms,70.<>ms,<>ms,<>ms,<>ms,<>ms,<>ms
When using the product in an environment with a lot of noise, set the digital filter. |
T1 (pulse width): 2.5μs or more T2 (rise/fall time): 1.25μs or
less |
T1 (pulse width): 50μs or more T2 (rise/fall time): 25μs or
less |
Non-voltage contact input
sink: NPN open collector transistor source: PNP open collector transistor |
Optocoupler isolation
|
LED lights up when input is ON
|
|
16 points
|
Detachable terminal block (M3 screw)
|
Transistor/sink output
|
DC5~30V
|
The total load current per 0.5A
/1 point common should be as follows. 4-point common: 0.8A or less |
0.1mA or less/30VDC
|
1.0V or less
|
1.5V or less
|
2.5μs or less/10mA or more (DC5~24V)
|
0.2ms or less/200mA or more (24VDC)
|
Optocoupler isolation
|
LED lights up when output is ON
|
Firmware update function | |
Scan monitoring function (watchdog timer setting) | |
Clock function | |
Write in RUN | Circuit block change during RUN |
Interrupt function | Multiple interrupt function |
PID control function | |
Constant Scan | |
Remote operation | Remote RUN/STOP |
Remote PAUSE | |
Remote RESET | |
Device/Label Memory Area Settings | |
Program capacity setting | |
Internal buffer capacity setting | |
Device initial value setting | |
Latching function | |
Memory card function | SD memory card forced stop |
Boot operation | |
Device/Label Access Service Processing Settings | |
Data logging capabilities | |
Memory dump function | |
Real-time monitoring function | |
RAS function | Self-diagnostic function |
Error clearing | |
Event history function | |
Backup/restore capability | |
Security Features | |
IP filter function | |
High-speed input/output capability | High-speed counter function |
Pulse width measurement function | |
Input interrupt function | |
Positioning function | |
PWM output function | |
Built-in analog functions | Analog input function |
Analog output function | |
Built-in Ethernet capability | |
CC-Link IE Field Network Basic Function | |
Serial communication function | |
MODBUS communication function |
This function uses an SD memory card to update the firmware version of the unit.
|
By monitoring the scan time, abnormalities in the hardware and programs of the CPU unit are detected.
|
It is used for time management in system functions such as event history function and date in data logging function.
|
The edited part on the ladder edit screen on the engineering tool is written to the CPU unit in circuit units. Edits that span multiple locations can be written to the CPU unit at the same time.
|
When an interrupt of another factor occurs when the interrupt program is executed, the execution of the program with a lower priority is suspended according to the set priority, and the program with a higher priority for which the execution conditions are met is executed.
|
PID control is performed by PID control instructions.
|
Run the program repeatedly while keeping the scan time constant.
|
Externally put the CPU unit in the RUN/STOP/PAUSE state while leaving the RUN/STOP/RESET switch of the CPU unit in the RUN position.
|
Externally put the CPU unit in the RUN/STOP/PAUSE state while leaving the RUN/STOP/RESET switch of the CPU unit in the RUN position.
|
When the CPU unit is in the STOP state, the CPU unit is reset by external operation.
|
Set the capacity of each area of the device/label memory.
|
Set to change the program capacity.
|
Sets the amount of area (internal buffer) that the system uses to temporarily store data logging results and memory dump collection results.
|
Set the initial value of the device to be used in the program to the device without programming.
|
Even when the power is turned off → ON, the contents of the device/label of the CPU unit are kept in power failure.
|
Even if the function using the SD memory card is running, you can disable the SD memory card without turning the power off.
|
Files stored on the SD memory card are transferred to the destination memory automatically determined by the CPU unit when the CPU unit is turned off→ ON or reset.
|
Set the number of device/label access service operations performed by the END process as a parameter.
|
Collects data at a specified interval or at any timing, and saves the collected data as a file on an SD memory card.
|
Saves the device value of the CPU unit at any time.
|
At the specified interval or at any timing, the contents of the specified device of the CPU unit are monitored in real time.
|
The CPU unit itself diagnoses the presence or absence of abnormalities.
|
Clears all ongoing continuation errors in bulk.
|
The CPU unit collects and stores errors that occur to the CPU unit, expansion board, expansion adapter, and intelligent function unit. You can check the saved history in chronological order.
|
This function backs up the program files, parameter files, device/label data, etc. of the CPU unit to the SD memory card. The backed up data can be restored as needed.
|
Prevents theft, falsification, erroneous operation, unauthorized execution, etc. due to unauthorized access from a third party to customer assets stored on PCs and customer assets in units in the FX5 system.
|
Identifies the IP address of an external device via Ethernet and blocks access from unauthorized IP addresses.
|
Using the inputs of the CPU unit and the high-speed pulse input/output unit, high-speed counters, pulse width measurements, input interrupts, and more can be performed.
|
Using the inputs of the CPU unit and the high-speed pulse input/output unit, high-speed counters, pulse width measurements, input interrupts, and more can be performed.
|
Using the inputs of the CPU unit and the high-speed pulse input/output unit, high-speed counters, pulse width measurements, input interrupts, and more can be performed.
|
Positioning operation can be performed using the transistor output of the CPU unit and the high-speed pulse input/output unit.
|
PWM output can be performed using the transistor output of the CPU unit and the high-speed pulse input/output unit.
|
Voltage input is possible with two analog inputs built into the FX2U CPU unit.
|
One analog output is built into the FX1U CPU unit, and voltage output can be performed.
|
Ethernet-related functions such as connection to MELSOFT products and GOT, socket communication, file transfer by FTP, web server (HTTP), SNTP client, and simple CPU communication function.
|
This function uses general-purpose Ethernet to communicate between a master station and a remote station.
|
These are serial communication-related functions such as simple PC-to-PC links, parallel links, MC protocols, inverter communication functions, and procedural communication.
|
Connection with MODBUS RTU/TCP compatible products is possible. Master and slave functions are available.
|
Operating ambient temperature | ||
Storage ambient temperature | ||
Ambient humidity | ||
Storage ambient humidity | ||
Vibration resistance | DIN rail mounting | Frequency: 5~8.4Hz |
Frequency:8.4~150Hz | ||
Direct installation | Frequency: 5~8.4Hz | |
Frequency:8.4~150Hz | ||
Shockproof | ||
Noise immunity | ||
Withstand voltage | Between the power supply terminal (AC power supply) and the ground terminal | |
DC24V service power supply and between input terminal (DC24V) and ground terminal | ||
Between output terminal (transistor) and ground terminal | ||
Insulation resistance | Between the power supply terminal (AC power supply) and the ground terminal | |
DC24V service power supply and between input terminal (DC24V) and ground terminal | ||
Between output terminal (transistor) and ground terminal | ||
ground | ||
Usage atmosphere | ||
Altitude used | ||
Installation location | ||
Overvoltage Category | ||
Pollution degree |
-20~55°C, no freezing and input
and output derating. For details, refer to the MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware). Products manufactured before June 2016 will be 6~0°C. For details on the Intelligent Function Unit, refer to the manual of each product. There is a difference in specifications when used below 55°C. For details, refer to the MELSEC iQ-F FX0S/FX5UJ/FX5U/FX5UC User's Manual (Hardware). |
-25~75°C, no freezing
|
When using in a low temperature environment with 5~95%RH, no condensation, use in an environment
where there is no sudden temperature change. If there is a sudden change in temperature due to opening or closing of the control panel, condensation may occur, which may cause fire, malfunction, or malfunction. Also, dehumidify with air conditioning to prevent condensation. |
5~95%RH, non-condensing
|
Fragment amplitude: 1.75mm 10 times in each direction of X, Y, and Z (80 minutes in total)
If the system includes equipment that meets the above vibration specifications according to IEC61131-2, the vibration resistance specifications of the entire system will be reduced to the specifications of that device. |
Acceleration: 4.9 m/s 2 10 times in each direction of X, Y, and Z (80 minutes in total)
If the system includes equipment that meets or meets the above vibration specifications according to IEC61131-2, the vibration resistance specifications of the entire system will be reduced to the specifications of that device. |
Fragment amplitude: 3.5mm 10 times in each direction of X, Y, and Z (80 minutes in total)
If the system includes equipment that meets the above vibration specifications according to IEC61131-2, the vibration resistance specifications of the entire system will be reduced to the specifications of that device. |
Acceleration: 9.8m/s 2 If the system includes a device that meets or meets the above vibration specifications according to IEC61131-2
, the vibration resistance specification of the entire system will be reduced to the specifications of that device. |
147 m/s 2, action time 11 ms, 3 times X, Y, and Z in half-wave sinusoidal pulses The criteria
are IEC61131-2. |
Noise voltage 1000Vp-p, noise width 1μs, period 30~100Hz
|
AC1.5kV for 1 minute
|
AC500V for 1 minute
|
AC500V for 1 minute
|
DC500V insulation resistance meter 10MΩ or more
|
DC500V insulation resistance meter 10MΩ or more
|
DC500V insulation resistance meter 10MΩ or more
|
For Class D grounding (grounding resistance: 100 Ω or less) < common grounding with strong electrical systems is not possible>
refer to the MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware Edition). |
No corrosive or flammable gases, no conductive dust
|
It cannot be used in an environment pressurized above 0~2000m
atmospheric pressure. It may fail. |
The sequencer itself in the control panel itself is intended to be installed in
an indoor environment. |
II. Indicates which distribution part the device is expected to be connected to, from the public distribution network to the machinery and equipment on the premises.
Category II applies to equipment supplied from fixed installations. The withstand surge voltage of equipment up to 300V rated is 2500V. |
2The following
is an index indicating the degree of generation of conductive substances in the environment in which the equipment is used. Pollution level 2 only produces non-conductive pollution. However, it is an environment in which temporary conductivity can occur due to accidental condensation. |